Thermogrip® H1714 is a hot melt adhesive formulated for low-temperature case forming and sealing. It delivers fiber-tearing bonds at application temperatures as low as 250°F, ensuring strong performance on a variety of board stocks.
Bostik Thermogrip® H1714 Features:
Low application temperature (250–275°F)
Clean running and easy processing
Strong fiber-tearing bonds
Bostik Thermogrip® H1714 Applications:
Case and carton sealing
High-speed packaging lines
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
