Bostik Thermogrip® H2259-01 is a light-colored, low-viscosity hot melt adhesive designed for strong bonding to polyolefin substrates and paper at cold application temperatures down to -15°F. It offers excellent die-cutting properties and consistent processability.
Bostik Thermogrip® H2259-01 Features:
Excellent cold temperature performance
Superior adhesion to polyolefin substrates
Low viscosity with good die-cutting
Bostik Thermogrip® H2259-01 Applications:
Labeling and packaging for low-temperature environments
Bonding to polyolefin and coated paper substrates
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
