Bostik Tread-Lock™
Bostik Tread-Lock™ is a durable, one-component construction adhesive formulated specifically for stair retread and riser installations. It offers excellent green grab, cures to a tough yet flexible bond, and helps reduce squeaks and impact sound.
Bostik Tread-Lock™ Features:
- Strong and flexible bond
- Easy to clean—even after cure
- Reduces stair squeaking and footstep noise
- Low odor and 0% solvents
Bostik Tread-Lock™ Applications:
- Retread and riser bonding
- Compatible with plywood, OSB, and existing wood floors
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
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CHEMICAL & PHYSICAL PROPERTIES |
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Chemical Properties |
Chemistry Type |
1-Part Silyl Modified Polymer |
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Adhesive Type |
Moisture Cure |
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Solvent percentage |
0% |
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VOC Compliant (calculated per SCAQMD Rule 1168) |
Yes (<30 g/L) |
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Flash Point, closed cup |
>200°F (93.3°C) |
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Use Environment |
New Construction |
Yes |
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Remodel |
Yes |
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Residential |
Yes |
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Offices/Light Commerical |
Yes |
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Heavy Commercial |
Yes |
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Offices |
Yes |
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Hospital |
Yes |
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Multifamily |
Yes |
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Highrise |
Yes |
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Exterior |
No |
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Wet Areas |
No |
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Substrates |
Plywood |
Yes |
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OSB |
Yes |
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Existing hardwood treads |
Yes, sanded |
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Terrazzo |
No |
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Ceramic Tile |
No |
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Concrete |
No |
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Gypsum Underlayments |
No |
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Cement Patch/Underlayment |
No |
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Well-Bonded Vinyl |
Yes |
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Stair Tread Types |
Solid Hardwood Retread or Riser |
Yes |
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Engineered Hardwood Retread or Riser |
Yes |
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Bamboo Retread or Riser |
Yes |
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HDF Retread or Risery |
Yes |
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New Structural Stair Tread |
No |
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Application Properties |
Ease of Gunning |
Easy |
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Odor |
Mild |
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Open/Working Time* |
90 min |
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Color |
White |
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Density (lbs/gallon) |
14.7 |
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Percentage of Water** |
0% |
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Adhesive Coverage Required for Bond: |
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Retread |
1/4" min bead around entire perimeter and "S" pattern repeating 8" max |
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Remodel Riser |
1/4" min bead around entire perimeter |
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Application Temperature |
50°F to 95°F (10°C to 35°C) |
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Cured Physical Properties |
Cure Time* |
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Light Foot Traffic |
6-8 hrs |
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Regular Traffic |
8-12 hrs |
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Elongation |
>180% |
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Service Temperature |
-40°F to 150°F (-40°C to 66°C) |
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LEED® Contribution |
EQ 4.1: Low-Emitting Materials: VOC (as calculated per SCAQMD Rule 1168) |
< 30 g/L |
