- DIE ATTACH
- The camera module industry has come into focus as smartphone and tablet manufacturers continue to develop advanced camera module technologies, capitalizing on this sector’s fast growth. Pros Technology is confident to provide our beloved customer with high-quality and reasonable price materials which would help optimize camera manufacturing process’s performance.
- Do not hesitate to contact us for more information about products and our specific solutions:
DIE ATTACH
Compact Camera Module Assembly Solutions – Die Attach
To facilitate lens function – either in auto- or fixed-focus lenses – an image sensor die is bonded to a substrate, which can be made from any number of materials, including FR4, ceramic or gold-plated PCBs.
Because pixel counts are increasing to enable greater image resolution, die sizes are getting larger, which can lead to increased warpage. Controlling die warpage and stress with robust die-attach materials is critical to highly reliable camera module operation, and it’s why our formulations ensure success. Our complete portfolio of low-temperature cure, low-stress, low-outgassing die attach pastes for exceptional performance and very high throughput is designed specifically for the requirements of modern camera module die bonding.
KEY MATERIAL PROPERTIES
- Low-temperature cure (80°C)
- Low-stress die attach
- Low outgassing
- Faster cure (Improved throughput)
- Low halogen / RoHS-compliant
RELATED PRODUCTS
1. PASTE
2. FILM
LOCTITE® ABLESTIK ATB 115U
