CONAP® CE-1170 is a solvent-based, single component, fast curing, acrylic resin solution.
Features
- QPL listed for MIL-I-46058C for Type AR
- IPC-CC-830B qualified
- Halogen-free (IEC 61249-2-21)
- Excellent hydrolytic stability
- UL94 V-0 listed
- Flexible coating
- Excellent adhesion to phenolic and epoxy-glass laminates
- Excellent reparability
- Tracer dye added for inspection under UV lighting
Applications
CONAP® CE-1170 provides an excellent electrical and moisture barrier for thin film applications on components and printed circuit boards.
Property |
Conditions |
Value |
Units |
Viscosity |
25°C / 77°F |
400 |
cP |
Specific Gravity |
25°C / 77°F |
0.95 |
|
Appearance |
|
Amber, slight haze |
|
Solids Content |
135°C for 45 min |
31 |
% |
Flash Point |
ASTM D93 |
13 55 |
°C °F |