Momentive Performance Materials Inc. offers a unique heat sink product that contains a TPG* core (>1500 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance.
FEATURES:
- High thermal conductivity
- CTE matching to semiconductors
- Light weight
APPLICATIONS:
- Power electronic package
- RF & microwave package
- Laser diode
- High power LED
Parallelism | 0.0005″ (0.01mm) |
Flatness | 0.001″/1″ (1μm/1mm) |
Surface Finish | Ra 16 μin (0.4 μm) |
Plating | Ni 160-250 μin (4-6 μm) / Au 40-80 μin (1-2 μm) |