Product Introduction
Devcon® 2 Ton® Epoxy is an extremely strong, medium-cure, water-resistant adhesive that self-levels after application. It is perfect for bonding parts in structural environments and potting electronic components and assemblies.
Devcon® 2 Ton® Epoxy Features
- Non-shrinking, rigid bonds.
- Fills poorly mated surfaces.
- Water-resistant formula.
- Good impact resistance.
- Gap fill: 0.01″ – 0.05″.
- Mix Ratio: 1:1.
Devcon® 2 Ton® Epoxy Applications
- Used for bonding parts in a structural environment or potting electronic components and assemblies.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Cured 7 Days @ 75°F (24°C)
| Property | Typical Value | Standard Test |
|---|---|---|
| Adhesive Lap Shear (GBS) | 2,250 psi (15.5 MPa) | ASTM D1002 |
| Dielectric Strength | 600 volts/mil (23.6 kV/mm) | ASTM D149 |
| Compression Strength | 11,000 psi (75.8 MPa) | ASTM D695 |
| Hardness | 83 Shore D | ASTM D2240 |
| Impact Resistance | 6.5 ft-lb/in² (13.6 kj/m²) | |
| Service Temperature | -40°F to 200°F (-40°C to 93°C) | |
| Solids by Volume | 100% | |
| Specific Volume | 25.2 in³/lb. (0.91 cm³/g) | |
| Tensile Elongation | 1% | |
| T-Peel | 2-3 pli (0.35 - 0.53 N/mm) |
Uncured Properties @ 72°F (23°C)
| Property | Typical Value |
|---|---|
| Color | Clear |
| Working Time | 8-12 minutes |
| Fixture Time | 30-35 minutes |
| Functional Cure | 2 hours |
| Full Cure | 16 hours |
| Mix Ratio by Volume | 1:1 |
| Mix Ratio by Weight | 1.2:1 |
| Mixed Density | 9.17 lb/gal (1.10 g/cm³) |
| Mixed Viscosity | 8,000 cP |
