Product Introduction: Devcon® 5 Minute® Epoxy DA051 – Fast-Acting Epoxy Adhesive
Devcon® 5 Minute® Epoxy DA051 is a rapid-curing, general-purpose adhesive and encapsulant in a 400ml cartridge. It provides a clear, hard, rigid bond and is suitable for various applications requiring a quick fix.
Devcon® 5 Minute® Epoxy DA051 Features:
- Bonds metals, ceramics, glass, wood, and concrete.
- Forms a clear, hard bond in minutes.
- Functional strength achieved in 1 hour.
- 100% reactive, no solvents.
- Low viscosity (10,000 cps).
- Open time of 4-7 minutes.
Devcon® 5 Minute® Epoxy DA051 Applications:
- Ideal for urgent repairs and maintenance tasks.
- Bonds various substrates for industrial and domestic applications.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Technical data should be considered representative or typical only and should not be used for specification purposes
| Cured 7 Days @ 75°F (24°C) | Typical Values | Standard Tests |
|---|---|---|
| Adhesive Lap Shear (GBS) | 1,900 psi (13.1 MPa) | Tensile Lap Shear ASTM D1002 |
| Dielectric Strength | 490 volts/mil (19.3 kV/mm) | Dielectric Strength ASTM D149 |
| Hardness | 85 Shore D | Cured Hardness Shore D ASTM D2240 |
| Impact Resistance | 5.5 ft-lb/in² (11.56 kJ/m²) | - |
| Service Temperature (Dry) | -40°F to 200°F (-40°C to 93°C) | - |
| Solids by Volume | 100% | - |
| Specific Volume | 25.1 in³/lb (0.99 cm³/g) | - |
| Tensile Elongation | 1% | - |
| T-Peel | 2-3 pli (0.35-0.53 N/mm) | - |
| Uncured Properties @ 72°F (23°C) | Typical Values |
|---|---|
| Color | Light Amber |
| Working Time | 3-6 minutes |
| Fixture Time | 10-15 minutes |
| Functional Cure | 0.75-1 hours |
| Full Cure | 12 hours |
| Mix Ratio by Volume | 1:1 |
| Mix Ratio by Weight | 1:1 |
| Mixed Density | 9.17 lb/gal (1.10 g/cm³) |
