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Devcon® MA2805 Low-halogen, Metal bonding, Acrylic, Structural adhesive

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Devcon® MA2805 is an advanced nonconductive, low halogen content two-part methacrylate adhesive designed for the structural bonding of various electronic assemblies. In addition, MA2805 does a superb job of bonding of metals without primers, and engineered thermoplastics and composite assemblies with little to no surface preparation. Combined at a 10:1 ratio by volume, MA2805 has a working time of approximately 3 minutes and achieves 0.35MPa(50 psi) in approximately 10 minutes and 3.45MPa(500 psi) in approximately 20 minutes on Al6061 at 23oC(73oF). This product provides a unique combination of high strength, excellent fatigue endurance, outstanding impact resistance, and superior toughness.

APPLICATION

Bonding 

PRODUCT CHARACTERISTICS

Chemical Class Acrylic
Appearance(Part A) Off-white
Appearance(Part B) Blue or black
Appearance(mixed) Light blue or black
Components Two component-requires mixing
Mix Ratio by Volume Part A: Part B=10:1
Application Bonding Solutions

TYPICAL PROPERTIES OF UNCURED MATERIALS

Density @ 23 oC (73 oF), g/cc(lbs./gal)

0.97(8.10)

Viscosity@ 25 oC TB92, 10 rpm, cps

45,000-70,000

Shelf life, mos

9

Part B:

 

Density @ 23 oC (73 oF), g/cc(lbs./gal) Viscosity@ 25 oC TB92, 10 rpm, cps

0.95(7.93)

25,000-45,000

Shelf life, mos

13

Mixed:

 

Mix ratio by weight, Part A : Part B

10:1

Mix ratio by Volume, Part A : Part B

10:1

Density @ 23 oC (73 oF), g/cc (lbs./gal)

0.95(7.95)

Gap Filling, mm(in)

Up to 6.4(0.25)

Work Time @ 23 oC (73 oF) min

3-4

Ionic Contaminants, ppm

 

TYPICAL PROPERTIES OF CURED MATERIALS

Adhesive Properties:

Lap Shear Strength @ 23 oC(73 oF), MPa(psi)

     Al6061, ASTM D1002

     G60, ASTM D1002

13.5-15.5(1958-2248)

16.5-18.5(2393-2683)

 

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