Devcon® MA2805 is an advanced nonconductive, low halogen content two-part methacrylate adhesive designed for the structural bonding of various electronic assemblies. In addition, MA2805 does a superb job of bonding of metals without primers, and engineered thermoplastics and composite assemblies with little to no surface preparation. Combined at a 10:1 ratio by volume, MA2805 has a working time of approximately 3 minutes and achieves 0.35MPa(50 psi) in approximately 10 minutes and 3.45MPa(500 psi) in approximately 20 minutes on Al6061 at 23oC(73oF). This product provides a unique combination of high strength, excellent fatigue endurance, outstanding impact resistance, and superior toughness.
APPLICATION
Bonding
PRODUCT CHARACTERISTICS
| Chemical Class | Acrylic |
| Appearance(Part A) | Off-white |
| Appearance(Part B) | Blue or black |
| Appearance(mixed) | Light blue or black |
| Components | Two component-requires mixing |
| Mix Ratio by Volume | Part A: Part B=10:1 |
| Application | Bonding Solutions |
TYPICAL PROPERTIES OF UNCURED MATERIALS
|
Density @ 23 oC (73 oF), g/cc(lbs./gal) |
0.97(8.10) |
|
Viscosity@ 25 oC TB92, 10 rpm, cps |
45,000-70,000 |
|
Shelf life, mos |
9 |
|
Part B: |
|
|
Density @ 23 oC (73 oF), g/cc(lbs./gal) Viscosity@ 25 oC TB92, 10 rpm, cps |
0.95(7.93) 25,000-45,000 |
|
Shelf life, mos |
13 |
|
Mixed: |
|
|
Mix ratio by weight, Part A : Part B |
10:1 |
|
Mix ratio by Volume, Part A : Part B |
10:1 |
|
Density @ 23 oC (73 oF), g/cc (lbs./gal) |
0.95(7.95) |
|
Gap Filling, mm(in) |
Up to 6.4(0.25) |
|
Work Time @ 23 oC (73 oF) min |
3-4 |
|
Ionic Contaminants, ppm |
|
TYPICAL PROPERTIES OF CURED MATERIALS
Adhesive Properties:
|
Lap Shear Strength @ 23 oC(73 oF), MPa(psi) Al6061, ASTM D1002 G60, ASTM D1002 |
13.5-15.5(1958-2248) 16.5-18.5(2393-2683)
|
