Prostech Philippines

Dual-Cure 9102 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. Dual-Cure 9102 encapsulating material is specially formulated to cure in shadowed areas over time with ambient moisture.

FEATURES:

UV/Visible light cure
Secondary moisture cure
Flexible encapsulant
Shadowed area performance
Moisture and thermal resistance

APPLICATIONS:

Chip on board
Chip on flex
Chip on glass
Wire bonding

Uncured properties
Property	Value	Test method
Solvent content	No Nonreactive solvent	N/A
Chemical class	Acrylated urethane	N/A
Appearance	Translucent light straw liquid	N/A
Soluble in	Organic solvents	N/A
Density, g/ml	1.09	ASTM D1875
Viscosity, cP (20rpm)	17,000 (nominal)	DSTM 502

Cured mechanical properties
Property	Value	Test method
Durometer hardness	D30-D50	ASTM D2240
Tensile at break, MPa [psi]	4.8 [703]	ASTM D638
Elongation at break, %	34	ASTM D638
Modulus of Elasticity, MPa [psi]	18.4 [2,670]	ASTM D638

Other cured properties
Property	Value	Test method
Boiling water absorption, % (2h)	0.4	ASTM D570
Refractive index (20°C)	1.50	ASTM D542
Linear shrinkage, %	2.0	ASTM D2566

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Dual-Cure 9102

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