ECOFRECTM PoP 50 is a tacky flux designed for a Package on Package process: pre-assembly of stacked BGA packages prior to reflow. It is suitable for lead-free and leaded soldering, with or without nitrogen.
ECOFRECTM PoP 50 can be applied by dipping or dispensing. Both methods allow for reproducible volumes of flux to be applied to the solder spheres.
ECOFRECTM PoP 50’s solderability is excellent with all finishes: Cu-OSP, NiAu, Immersion Sn, and Ag.
Color | Amber |
Odor | Very low |
Solubility in water | Not soluble |
Solubility in alcohol | Soluble |
Classification according ANSI/J-STD-004 | REL0 |
Halogen content | No halogen |
Density at 20°C | 1 |
Viscosity (Pa.s at 20°C) (Measured on BROOKFIELD RVT viscometer with Mobile F HELIPATH system, at 5 rpm) |
50 – 150 |