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ECOFREC PoP 50 – No-clean tacky flux

Package on Package process

  • Product code: ECOFREC PoP 50
  • Manufacturer:
  • Package size: 10g or 30g Syringe/ 100g or 500g Syringe/ 300g Cartridge
  • Shelf Life: 12 months

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ECOFRECTM PoP 50 is a tacky flux designed for a Package on Package process: pre-assembly of stacked BGA packages prior to reflow. It is suitable for lead-free and leaded soldering, with or without nitrogen.

ECOFRECTM PoP 50 can be applied by dipping or dispensing. Both methods allow for reproducible volumes of flux to be applied to the solder spheres.

ECOFRECTM PoP 50’s solderability is excellent with all finishes: Cu-OSP, NiAu, Immersion Sn, and Ag.

ColorAmber
OdorVery low
Solubility in waterNot soluble
Solubility in alcoholSoluble
Classification according ANSI/J-STD-004REL0
Halogen contentNo halogen
Density at 20°C1
Viscosity (Pa.s at 20°C)
(Measured on BROOKFIELD RVT viscometer with Mobile F HELIPATH system, at 5 rpm)		50 – 150

TDS:Download

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    Notices when setup a PoP Assembly with Solder Paste and Flux
    https://prostech.ph/notices-when-setup-a-pop-assembly-with-solder-paste-and-flux/

    Solder PasteDipping the componentsPick and Place the ComponentsTransport the finished productsReflow Profile Solder Paste To prepare for component dipping with

    Package-on-Package Process and Solder Paste usage notices
    https://prostech.ph/package-on-package-process-and-solder-paste-usage-notices/

    Assembly MethodPre-joint AssemblyOn-the-fly assemblyFluxingFlux/Solder Paste DipDownload the whitepaper of PCB Assembly System Setup for PoP Assembly Method There are two

    What is PoP Assembly? What are benefits?
    https://prostech.ph/what-is-pop-assembly-what-are-benefits/

    What is PoP Assembly?Bottom PackageTop PackageWhy PoP? The benefits of Package-on-Package Assembly?Where will PoP be used?Dominant useSome pure memory PoP

    Outstanding Feature Product Group