ECOFRECTM POP WS30 is a water-soluble tacky flux designed for the Package on Package process and Flip Chip process. It is suitable for lead-free and leaded soldering, with or without nitrogen. The rheology and the tackiness of ECOFRECTM POP WS30 are optimized to sufficiently hold packages in place before and during reflow. PCB cleaning is required after soldering with a water-based process.
BENEFITS:
- Application by dipping or dispensing
- An excellent solderability with all finishes: Cu-OSP, NiAu, Immersion Sn, and Ag
- Post-soldering residues are easily cleaned either with pure water or with detergent
- A stable process as great reproducible volumes of flux is applied
- No CMR-containing substances
- RoHS & REACH compliant
Color | Light yellow |
Odor | Very low |
Solubility in water | Soluble |
Solubility in alcohol | Soluble |
Density at 20°C | About 1 |
Typical viscosity at 25°C Thermoscientific rheometer* |
About 20Pa.s |