Home > Ecofrec POP WS30 – Water Soluble Tacky Flux

Ecofrec POP WS30 – Water Soluble Tacky Flux

PoP and Flip Chip Process - Excellent Wetting Properties

  • Product code: Ecofrec POP WS30
  • Manufacturer:
  • Package size: 30g / 30cc SYRINGE
  • Shelf Life: 6 months

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ECOFRECTM POP WS30 is a water-soluble tacky flux designed for the Package on Package process and Flip Chip process. It is suitable for lead-free and leaded soldering, with or without nitrogen. The rheology and the tackiness of ECOFRECTM POP WS30 are optimized to sufficiently hold packages in place before and during reflow. PCB cleaning is required after soldering with a water-based process.

BENEFITS:

  • Application by dipping or dispensing
  • An excellent solderability with all finishes: Cu-OSP, NiAu, Immersion Sn, and Ag
  • Post-soldering residues are easily cleaned either with pure water or with detergent
  • A stable process as great reproducible volumes of flux is applied
  • No CMR-containing substances
  • RoHS & REACH compliant

Typical Properties

Color Light yellow
Odor Very low
Solubility in water Soluble
Solubility in alcohol Soluble
Density at 20°C About 1

Typical viscosity at 25°C

Thermoscientific rheometer*

 About 20Pa.s

Resources

TDS:Download

Related Article

Notices when setup a PoP Assembly with Solder Paste and Flux
https://prostech.ph/notices-when-setup-a-pop-assembly-with-solder-paste-and-flux/

Solder PasteDipping the componentsPick and Place the ComponentsTransport the finished productsReflow Profile Solder Paste To prepare for component dipping with
Package-on-Package Process and Solder Paste usage notices
https://prostech.ph/package-on-package-process-and-solder-paste-usage-notices/

Assembly MethodPre-joint AssemblyOn-the-fly assemblyFluxingFlux/Solder Paste DipDownload the whitepaper of PCB Assembly System Setup for PoP Assembly Method There are two
What is PoP Assembly? What are benefits?
https://prostech.ph/what-is-pop-assembly-what-are-benefits/

What is PoP Assembly?Bottom PackageTop PackageWhy PoP? The benefits of Package-on-Package Assembly?Where will PoP be used?Dominant useSome pure memory PoP

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