ECOFRECTM TF 48 is a halogen-free, no-clean tacky flux designed for lead-free and leaded applications. After reflow, the residue is non-corrosive. ECOFRECTM TF 48 is highly recommended material used in POP assembly – Ball Attach Process.

POP assembly or called ball attach is used to combine vertically discrete logic and memory BGA packages to achieve higher component density.

The benefits are saving of PCB space and minimizing track length in between interoperating components.

During assembly, the bottom of the POP stack is directly placed on the PCB, the other package is stacked on top. The connection in between the packages and to the PCB is achieved during reflow soldering.

FEATURES:

• Free of halide (Fluoride, Chloride, Bromide) and amine
• Noncorrosive residue
• The complex blending of rosins, activators and solvents.

RECOMMENDED APPLICATIONS:

• Spheres soldering
• Components rework (BGA, SMT components)
• Flip Chip process

Best in class for dispensing, dipping, and printing applications