ECORELTM EASY 802M2 offers a good balance between wettability, printing capability and ability to withstand various thermal profiles.
ECORELTM EASY 802M2 exhibits high printing speed, excellent abandon time and long steady tackiness.
It can withstand high thermal profiles, with and without nitrogen, leading to consistent and shiny solder joints on all standard finishes.
Residues after reflow are non-corrosive and do not need to be removed to ensure the reliability of the PCB’s. However, those residues are easily cleanable with a large range of cleaners : hydro-carbonated solvents, halogenated solvents and detergent solutions including the INVENTEC cleaning solutions.
Alloy | Sn62PbAg2 |
Melting Point (ºC) | 178 |
Melting Content (%) | 89.5 |
Post Reflow Residue (%) | 47 – 54 |
Halogen Content (%) | No Halogen |
Power Size (μm) | 25 - 45 |
Flux Classification | L0/ 113 |
Solder Balling Test | class 1 |
Copper Mirror | Pass - ANSI/ J-STA-004 |
Copper Corrosion | Pass - ANSI/ J-STA-004 |
SIR (IPC) | |
SIR (Bellcore) | Pass - ANSI/ J-STA-004 |
Electromigration (IPC/ Bellcore) | |
Bono Corrosion Test |