ECOREL FREE 300-31A is a no-clean halogen-free lead-free solder paste developed with the reliable chemistry of the ECOREL range. It is designed to minimize flux spattering, solder leaking and voiding to achieve consistent bond-line thickness (BLT) between the large chips and the DCB substrate.
BENEFITS:
- Low voiding to achieve consistent bond line thickness
- Very good wetting on copper surfaces
- Low post-reflow residues
- Minimized copper oxidation for higher first-pass yield
- Minimized risks for wire-bonding defects
- No Halogen
- Lead-Free
Alloy | Sn96,5Ag3.5 |
Melting Point (ºC) | 221 |
Melting Content (%) | 89 ± 0,5 |
Post Reflow Residue (%) | approximately 5% by w/w |
Halogen Content (%) | No Halogen |
Power Size (μm) | 25 – 45 microns / Type 3 |
Flux Classification | ROL0, 113 (ISO 9454) |
Solder Balling Test | Pass – ANSI/ J-STA-005 |
Copper Mirror | Pass – ANSI/ J-STA-004 |
Copper Corrosion | Pass – ANSI/ J-STA-004 |
SIR (IPC) | Pass – ANSI/ J-STA-004 |
SIR (Bellcore) | Pass – Bellcore |
Electromigration (IPC/ Bellcore) | Pass – ANSI/J-STD-004/ Bellcore |
Bono Corrosion Test | Pass, FC = 1,4%; Inventec procedure |