ECOREL FREE HT235-16LVD is a no-clean, lead-free solder paste using Tin-Antimony (SnSb5) alloy formulated with the reliable chemistry of the ECORELTM LVD range. It’s specially developed for hybrid, microelectronics, or stacking assemblies where a higher melting point could be required at the first soldering stage. Provided in Type 6 granulometry to accommodate soldering of ultrafine pitch components.
BENEFITS:
- Low voiding to offer great heat dissipation
- Suitable for electronic assemblies operating close to 200°C
- Good first pass yield testability in ICT
- Increase lifetime and reliability of your product, hence reduces risk of premature failures.
- No CMR-containing substances
- Lead Free & no halogen
Alloy | Sn95Sb5 |
Melting Point (ºC) | 232-240 |
Melting Content (%) | 88+/-0.5 |
Post Reflow Residue (%) | approximately 5% by w/w |
Halogen Content (%) | No Halogen |
Power Size (μm) | 5 – 15 microns / Type 6 |
Flux Classification | ROL0, 113 (ISO 9454) |
Solder Balling Test | Pass – ANSI/ J-STA-005 |
Copper Mirror | Pass – ANSI/ J-STA-004 |
Copper Corrosion | Pass – ANSI/ J-STA-004 |
SIR (IPC) | Pass – ANSI/ J-STA-004 |
SIR (Bellcore) | Pass – Bellcore |
Electromigration (IPC/ Bellcore) | Pass – ANSI/J-STD-004/ Bellcore |
Bono Corrosion Test | Pass, FC = 1,4%; Inventec procedure |