Home > Ecorel Free HT 235-16LVD – Sn95Sb5 Lead Free alloy solder paste (Type 6)

Ecorel Free HT 235-16LVD – Sn95Sb5 Lead Free alloy solder paste (Type 6)

  • Product code: Ecorel Free HT 235-16LVD
  • Manufacturer:
  • Package size: 500g Jars or 600g Cartridges
  • Shelf Life: 6 months

Request Quote Request Sample

ECOREL FREE HT235-16LVD is a no-clean, lead-free solder paste using Tin-Antimony (SnSb5) alloy formulated with the reliable chemistry of the ECORELTM LVD range. It’s specially developed for hybrid, microelectronics, or stacking assemblies where a higher melting point could be required at the first soldering stage. Provided in Type 6 granulometry to accommodate soldering of ultrafine pitch components.

BENEFITS:

  • Low voiding to offer great heat dissipation
  • Suitable for electronic assemblies operating close to 200°C
  • Good first pass yield testability in ICT
  • Increase lifetime and reliability of your product, hence reduces risk of premature failures.
  • No CMR-containing substances
  • Lead Free & no halogen
AlloySn95Sb5
Melting Point (ºC)232-240
Melting Content (%)88+/-0.5
Post Reflow Residue (%)approximately 5% by w/w
Halogen Content (%)No Halogen
Power Size (μm)5 – 15 microns / Type 6
Flux ClassificationROL0, 113 (ISO 9454)
Solder Balling TestPass – ANSI/ J-STA-005
Copper MirrorPass – ANSI/ J-STA-004
Copper CorrosionPass – ANSI/ J-STA-004
SIR (IPC)Pass – ANSI/ J-STA-004
SIR (Bellcore)Pass – Bellcore
Electromigration (IPC/ Bellcore)Pass – ANSI/J-STD-004/ Bellcore
Bono Corrosion TestPass, FC = 1,4%; Inventec procedure

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    What is System-in-Package (SIP)?
    https://prostech.ph/what-is-system-in-package-sip/

    What is System-in-Package (SiP)?Different from SOC (System-on-a-Chip)The updated version of MCM (multichip module)Advantages and Disadvantages of SIPAdvantageDisadvantage What is System-in-Package

    Notices when setup a PoP Assembly with Solder Paste and Flux
    https://prostech.ph/notices-when-setup-a-pop-assembly-with-solder-paste-and-flux/

    Solder PasteDipping the componentsPick and Place the ComponentsTransport the finished productsReflow Profile Solder Paste To prepare for component dipping with

    Package-on-Package Process and Solder Paste usage notices
    https://prostech.ph/package-on-package-process-and-solder-paste-usage-notices/

    Assembly MethodPre-joint AssemblyOn-the-fly assemblyFluxingFlux/Solder Paste DipDownload the whitepaper of PCB Assembly System Setup for PoP Assembly Method There are two

    What is PoP Assembly? What are benefits?
    https://prostech.ph/what-is-pop-assembly-what-are-benefits/

    What is PoP Assembly?Bottom PackageTop PackageWhy PoP? The benefits of Package-on-Package Assembly?Where will PoP be used?Dominant useSome pure memory PoP

    Outstanding Feature Product Group