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Ecorel HT 301T – Pb93,5Sn5Ag1,5 Leaded solder paste

  • Product code: Ecorel HT 301T
  • Manufacturer:
  • Package size: 250g & 500g Jar
  • Shelf Life: 12 months

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ECOREL HT 301T is a No-Clean solder paste with high lead content (Pb93,5Sn5Ag1,5), designed for power semiconductors and high-temperature assembly of micromodules and embedded systems. Formulated in order to achieve very low levels of voiding, especially for power components (QFN, DPAK, etc.) and to remove easily the flux residues when post-reflow cleaning is required.

ECORELTM HT 301T exhibits also high-speed printing and excellent abandon time performance.

BENEFITS:

  • Low void level to improve heat dissipation
  • Very good wetting on NiAu, Ni, NiP, and Cu lead frames
  • Easy-to-clean flux residues
  • Increase the lifetime and reliability of your product, hence reducing risk of premature failures.
  • Fast paste-printing speed
  • No CMR containing substances
  • No Halogen

 

Typical Properties

SPECIFICATIONS ECOREL HT 301T T3
Alloy Pb93,5Sn5Ag1,5
Melting point (°C/°F) 296-301°C/565-574°F
Metal content (%) 90
Post reflow residues Approximately 3% by w/w
Halogen content No Halogen
Powder size 25 – 45 microns / Type 3

Resources

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