ECOREL FREE 305-31A solder paste, which utilizes the dependable chemistry of the ECOREL series, is a halogen-free and lead-free option that aims to reduce flux spattering, solder leakage, and voiding in order to achieve a uniform bond-line thickness (BLT) between the DCB substrate and large chips.
FEATURES:
- SAC305 lead-free solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
BENEFITS:
- Low voiding to achieve consistent bond line thickness
- Very good wetting on copper surfaces
- Low post-reflow residues
- Minimized copper oxidation for higher first-pass yield
- Minimized risks for wire-bonding defects
- Halogen Free
- Lead-Free
- No CMR-containing substances
Alloy | Sn96,5Ag3Cu0.5 |
Melting Point (ºC) | 217 |
Melting Content (%) | 89 ± 0,5 |
Post Reflow Residue (%) | approximately 5% by w/w |
Halogen Content (%) | No Halogen |
Power Size (μm) | 25 – 45 |
Flux Classification | ROL0, 113 (ISO 9454) |
Solder Balling Test | Pass – ANSI/ J-STA-005 |
Copper Mirror | Pass – ANSI/ J-STA-004 |
Copper Corrosion | Pass – ANSI/ J-STA-004 |
SIR (IPC) | Pass – ANSI/ J-STA-004 |
SIR (Bellcore) | Pass – Bellcore |
Electromigration (IPC/ Bellcore) | Pass – ANSI/J-STD-004/ Bellcore |
Bono Corrosion test (85°C / 85% HR – 15 days) | Pass Corrosion Factor <8% |