Home > Specialty Materials > Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMISR4

Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMISR4

  • Product code: 84-1LMISR4
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 365 days

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LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.

Key Features:

  • Conductive
  • Box oven cure
  • Excellent dispensability, minimal tailing and stringing

Applications:

  • Die Attach 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Đặc điểm Gía trị
Thixotropic Index (0.5/5 rpm) 5.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm		 8000
Work Life @ 25°C, Physical worklife by % filler, hours 18
Flash Point – See SDS  

TYPICAL CURING PERFORMANCE

Cure Schedule 1 hour @ 175°C
Alternate Cure Schedule 3 to 5 minute ramp to 175°C + 1 hour @ 175°C
Weight Loss 5.3

TYPICAL PROPERTIES OF CURED MATERIAL

Glass Transition Temperature, TMA penetration, °C 120

Coefficient of Thermal Expansion, TMA expansion

Below Tg, ppm/°C

Above Tg, ppm/°C

 

40

150
Water Extract Conductivity, mS/m ≤2.0
Weight Loss @ 300ºC, TGA, % 0.35

Tensile Modulus, DMTA :

@ -65°C

@ 25 °C

@ 150 °C

@ 250 °C

N/mm² 4,400
(psi) (640,000)

N/mm² 3,900
(psi) (570,000)

N/mm² 2,000
(psi) (290,000)

N/mm² 300
(psi) (44,000)

TDS:Download

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