LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.

Key Features:

Conductive
Box oven cure
Excellent dispensability, minimal tailing and stringing

Applications:

Die Attach

Typical Properties

TYPICAL PROPERTIES OF UNCURED MATERIAL

Đặc điểm	Gía trị
Thixotropic Index (0.5/5 rpm)	5.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm	8000
Work Life @ 25°C, Physical worklife by % filler, hours	18
Flash Point – See SDS

TYPICAL CURING PERFORMANCE

Cure Schedule	1 hour @ 175°C
Alternate Cure Schedule	3 to 5 minute ramp to 175°C + 1 hour @ 175°C
Weight Loss	5.3

TYPICAL PROPERTIES OF CURED MATERIAL

Glass Transition Temperature, TMA penetration, °C	120
Coefficient of Thermal Expansion, TMA expansion Below Tg, ppm/°C Above Tg, ppm/°C	40 150
Water Extract Conductivity, mS/m	≤2.0
Weight Loss @ 300ºC, TGA, %	0.35
Tensile Modulus, DMTA : @ -65°C @ 25 °C @ 150 °C @ 250 °C	N/mm² 4,400 (psi) (640,000) N/mm² 3,900 (psi) (570,000) N/mm² 2,000 (psi) (290,000) N/mm² 300 (psi) (44,000)

Resources

TDS:Download

IPA – Isopropyl Alcohol ES605L

https://prostech.ph/ipa-isopropyl-alcohol-es605l/

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https://prostech.ph/3m-scotch-weld-polyurethane-reactive-pur-easy-250-wood-adhesive-ez250120-2/

3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Wood Adhesives are 100% solid, warm temperature applied, moisture curing urethanes. These products