LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
Key Features:
- Conductive
- Box oven cure
- Excellent dispensability, minimal tailing and stringing
Applications:
- Die Attach
TYPICAL PROPERTIES OF UNCURED MATERIAL
Đặc điểm | Gía trị |
Thixotropic Index (0.5/5 rpm) | 5.6 |
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm |
8000 |
Work Life @ 25°C, Physical worklife by % filler, hours | 18 |
Flash Point – See SDS |
TYPICAL CURING PERFORMANCE
Cure Schedule | 1 hour @ 175°C |
Alternate Cure Schedule | 3 to 5 minute ramp to 175°C + 1 hour @ 175°C |
Weight Loss | 5.3 |
TYPICAL PROPERTIES OF CURED MATERIAL
Glass Transition Temperature, TMA penetration, °C | 120 |
Coefficient of Thermal Expansion, TMA expansion Below Tg, ppm/°C Above Tg, ppm/°C |
40 150 |
Water Extract Conductivity, mS/m | ≤2.0 |
Weight Loss @ 300ºC, TGA, % | 0.35 |
Tensile Modulus, DMTA : @ -65°C @ 25 °C @ 150 °C @ 250 °C |
N/mm² 4,400 N/mm² 3,900 N/mm² 2,000 N/mm² 300 |