ES5300 is a specialized epoxy adhesive formulated for bonding electronic devices. It is specifically designed to cure at temperatures ranging from 100 to 110 degrees Celsius. This adhesive has a high viscosity and excellent thixotropic properties. It can also be controlled in terms of flow and has resistance to sagging. Additionally, ES5300 offers easy handling, and chemical resistance, and provides a perfect surface gloss. Moreover, this resin exhibits exceptional durability and successfully passes various environmental test experiments.
FEATURES AND BENEFITS
- Excellent chemical resistance and solvent resistance
- High thixotropic index. It is able to hold the shape of resin without any failure or deformation
- Excellent retention of electrical insulation properties under high humidity conditions
- Good reactivity at the temperature higher than 100°C
- Complies to the 2011/65/EU RoHS regulations
- Complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm
TYPICAL UNCURED PROPERTIES
| Properties | ES5300 |
| Appearance | Liquid |
| Color | Red |
| Viscosity *25°C, cps, S14, 3 rpm | > 230 000 |
| Viscosity *25°C, cps, S14, 0.3 rpm | > 1700 000 |
| Thixotropic Index | >7 |
TYPICAL CURING PROPERTIES
| Properties | |
| Pot Life, 25°C, days | 3 |
| Through Cure Time 100°C, min |
10 |
TYPICAL CURED PROPERTIES
| Glass Transition Temp., (DSC), C | 110 |
| CTE (*2) (>Tg), μm/m/°C | 40 |
| CTE (*2) (<Tg), μm/m/°C | 180 |
| Durometer Hardness, Shore D | 83 |
| Water Absorption Ratio (25 C/24hr), % | 0.33 |
| Water Absorption Ratio (80°C/24hr), % | 1.11 |
| Water Absorption Ratio (97°C/24hr), % | 0.49 |
| Shear Strength Al vs. Al,kgf/cm² | 60 |
| Volume Resistivity, ohm-cm | 5*10^15 |
| Surface Resistivity, ohm | 5*10^14 |
| Dielectric Constant, 100Hz | 3.8 |