JE185 is two-component epoxy adhesive. The resin and hardener have good fluidity and operability after being evenly stirred and are suitable for potting of electronic components. This resin exhibits excellent toughness, low thermal stress and thermal shock resistance. A clean surface can be applied, the precise ratio while mixing Part A and Part B, and complete mixing of these two components are required to obtain optimum properties.
Key Features
- After mixing, this resin is easy to operate and has excellent fluidity. It is used for potting.
- This product has no volatile materials and will not release any toxic volatilizations.
- This product complies to the 2011/65/EU RoHS regulations.
- The recommended temperature range of this product is -55 oC~160 oC.
- This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.
| Uncured property | JE185A | JE185B |
| Appearance | Liquid | Liquid |
| Color | Black | Yellow |
| Viscosity 25oC, S14 100rpm cps |
1,300 | <200 |
| Specific Gravity | 1.16 | 1.01 |
| Cured Property | Value |
| Mix Ratio (A：B) by Weight | 2：1 |
| Pot Life 25oC, min | 30 |
| Surface Dry Time, 25oC, hr | 24 |
| Through Cure Time, 25oC, days | 5-7 |
| Through Cure Time, 80oC, hr | 1 |
| Glass Transition Temp.,(TMA),oC | 55 |
| Durometer Hardness, Shore D | 83 |
| CTE*2 (<Tg), µ m/m/ oC | 64 |
| CTE*2 (>Tg), µ m/m/ oC | 228 |
| Shear Strength* Al vs. Al, kgf/cm2 | 121 |