FK862 is a photo-curing adhesive designed for glass and plastics bonding. This resin can cure rapidly under visible light (436nm) and offers good toughness after curing. Besides, this product exhibits great elongation to solve the problem of a temperature difference when bonding. Additionally, this resin passed the environmental test experiment when bonding to glass, FPC, acrylate, PC, or ABS.
Key features
- This resin has high viscosity, excellent toughness, shock resistance, and thermal shock resistance.
- This product exhibits great elongation, perfect flexibility, and high adhesion strength when bonding to glass or plastics..
- This product complies to the 2011/65/EU RoHS regulations.
Recommended Applications:
- Reinforcement the cables for computers, household appliances and communication products
- Bonding substrate: Wafer to FR4
| Product No. | FP801 |
| Substrate | Wafer / FR4 |
| Appearance | White fog Liquid |
| Viscosity(cps) / Ti | 4,500~6,100 / 5 |
| Curing Condition(nm，mj/cm²) | 365 , 1500 ~2000 |
| Tg(℃) | 86 |
| Hardness (SHORE) | D76 |
| Shear Strength(kgf/cm²) | 44 |
| Elongation (%) | 56 |
| Temperature Range(℃) | -40 ~ 100 |
