FX027W is moisture curing silicone for metals and glass bonding. This product is cured by the moisture in the air. The curing system of this product is alkoxy. It is not stinky and has fast curing properties. This resin is different from the traditional PU which contains isocyanate. This product has good non-yellowing properties. This resin is well suited for electronic devices casting and bonding.
FEATURES:
This product has low viscosity and good leveling properties. It also has surface dryness in 15 minutes.
This resin has flexible properties and fracture energy.
This product has stable properties in a wide range of temperature.
This product is one component adhesive. It is easy to use.
This resin will fast cure in the air. It can have surface dryness in a short time.
Stable under -40~230 oC.
This prodcut complies to the 2011/65/EU RoHS regulations.
