JD642-6 is one component epoxy adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.

FEATURES:

This product is solvent-free, non-volatile, system and has no volatile materials and will not release any toxic volatilizations.
This resin is low viscosity, excellent fluidity and easy to operate. It is suited for casting.
The hardening surface will not exhibit a surface oiliness and poor gloss.
This product complies to the 2011/65/EU RoHS regulations.
This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.

Typical Properties

Appearance	Liquid
Color	Black
Viscosity 25oC, S21 20rpm, cps	240 ~ 450
Pot Life 25oC, days	2
Through Cure Time 130oC, min	10
Through Cure Time 150oC, min	5-8

Resources

TDS:Download

Underfills for reinforcing Components on PCBs

https://prostech.ph/underfills-for-reinforcing-components-on-pcbs/

What is Underfill? Why underfill?Three types of Underfills 1. Full Underfill2. Corner bonding3. Edge bonding Materials and equipment for Underfill EquipmentMaterials What is Underfill?

Materials for Underfill and Encapsulation for PCB assembly

https://prostech.ph/materials-for-underfill-and-encapsulation-for-pcb-assembly/

UnderfillEncapsulation Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of