NC884-8 is one component of acrylic resin adhesive for electronic devices. This product has fast curing properties. It is able to reduce the working time and increase efficiency at the same time. This resin develops strong structural bonds and has excellent dimensional stability. This product exhibits high thermal conductivity, and it can be suitable for more applications.

FEATURES:

The hardening surface will not exhibit a surface oiliness. It has good insulation.
This product has high thixotropic properties. When using, this product will not be stringing. It has more applications.
This resin has high Tg, high thermal conductivity and low shrinkage. It is suited for underfill applications.
This product complies with the 2011/65/EU RoHS regulations.
This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.

Typical Properties

Appearance	Liquid
Color	Pink
Viscosity 25oC, S14 50rpm, cps	10,000~16,000
Viscosity 25oC, S14 5rpm, cps	30,000~50,000
Thixotropic Index	2.2
Average Particle Size, μm	30
Maximum Particle Size, μm	50
Pot Life 25oC, hr	24
Through Cure Time 100oC, seconds	120
Through Cure Time 110oC, seconds	90

Resources

TDS:Download

Underfills for reinforcing Components on PCBs

https://prostech.ph/underfills-for-reinforcing-components-on-pcbs/

What is Underfill? Why underfill?Three types of Underfills 1. Full Underfill2. Corner bonding3. Edge bonding Materials and equipment for Underfill EquipmentMaterials What is Underfill?

Materials for Underfill and Encapsulation for PCB assembly

https://prostech.ph/materials-for-underfill-and-encapsulation-for-pcb-assembly/

UnderfillEncapsulation Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of