NC884-8 is one component of acrylic resin adhesive for electronic devices. This product has fast curing properties. It is able to reduce the working time and increase efficiency at the same time. This resin develops strong structural bonds and has excellent dimensional stability. This product exhibits high thermal conductivity, and it can be suitable for more applications.
FEATURES:
The hardening surface will not exhibit a surface oiliness. It has good insulation.
This product has high thixotropic properties. When using, this product will not be stringing. It has more applications.
This resin has high Tg, high thermal conductivity and low shrinkage. It is suited for underfill applications.
This product complies with the 2011/65/EU RoHS regulations.
This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.