The typical process for package-on-package (PoP) assembly involves applying solder paste onto the substrate, inserting the logic chip into the paste, and then dipping the memory package into a no-clean PoP flux or PoP solder paste before placing it on top of the logic chip. The entire assembly is then reflowed. Indium Corporation has developed PoP materials that are specifically formulated with optimal viscosity and rheology to ensure maximum transfer of flux or paste during dipping while maintaining consistent volume.
FEATURES:
- For high-density and advanced package technology, We provide new Solder Paste for PoP applications.
- Package on Package Solder Paste has better wettability, solderability, and low void than others.
Item | Specification | Standard |
Appearance | Gray paste w/o visible foreign and clusters | |
Alloy composition | Sn/Ag3.0/Cu0.5/X | |
Melting Point | 217~219°C | |
Particle Size |
(Type 3) +45µm < 1%,─20µm < 10% (Type 4) +38µm < 1%,─20µm < 10% (Type 5) +25µm < 1%,─15µm < 10% (Type 6) +15µm < 1%,─ 5µm < 10% |
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Powder Shape | Spherical | |
Flux Content | 12.0±1.0wt.% | JIS-Z-3197, 8.1.2 |
Viscosity | 200±30 Pa.s (25±1°C, 10rpm, Malcom) | JIS-Z-3284, Annex 6 |
Flux Type | ROL0 | J-STD-004 |