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Formosa PF606-P26 – Package on Package SAC305 Solder Paste

For high density and advanced package technology

  • Product code: PF606-P26
  • Manufacturer: Shenmao
  • Package size: 500g Jar
  • Shelf Life: 6 months

 

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The typical process for package-on-package (PoP) assembly involves applying solder paste onto the substrate, inserting the logic chip into the paste, and then dipping the memory package into a no-clean PoP flux or PoP solder paste before placing it on top of the logic chip. The entire assembly is then reflowed. Indium Corporation has developed PoP materials that are specifically formulated with optimal viscosity and rheology to ensure maximum transfer of flux or paste during dipping while maintaining consistent volume.

FEATURES:

  • For high-density and advanced package technology, We provide new Solder Paste for PoP applications.
  • Package on Package Solder Paste has better wettability, solderability, and low void than others.

Typical Properties

Item Specification Standard
Appearance Gray paste w/o visible foreign and clusters  
Alloy composition Sn/Ag3.0/Cu0.5/X  
Melting Point 217~219°C  
Particle Size

(Type 3) +45µm < 1%，─20µm < 10%

(Type 4) +38µm < 1%，─20µm < 10%

(Type 5) +25µm < 1%，─15µm < 10%

(Type 6) +15µm < 1%，─ 5µm < 10%

  
Powder Shape Spherical  
Flux Content 12.0±1.0wt.% JIS-Z-3197, 8.1.2
Viscosity 200±30 Pa．s (25±1°C, 10rpm, Malcom) JIS-Z-3284, Annex 6
Flux Type ROL0 J-STD-004

Resources

TDS:Download

Related Article

Notices when setup a PoP Assembly with Solder Paste and Flux
https://prostech.ph/notices-when-setup-a-pop-assembly-with-solder-paste-and-flux/

Solder PasteDipping the componentsPick and Place the ComponentsTransport the finished productsReflow Profile Solder Paste To prepare for component dipping with
Package-on-Package Process and Solder Paste usage notices
https://prostech.ph/package-on-package-process-and-solder-paste-usage-notices/

Assembly MethodPre-joint AssemblyOn-the-fly assemblyFluxingFlux/Solder Paste DipDownload the whitepaper of PCB Assembly System Setup for PoP Assembly Method There are two
What is PoP Assembly? What are benefits?
https://prostech.ph/what-is-pop-assembly-what-are-benefits/

What is PoP Assembly?Bottom PackageTop PackageWhy PoP? The benefits of Package-on-Package Assembly?Where will PoP be used?Dominant useSome pure memory PoP

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