ULTRAWIDE FP771 is designed for the bonding of PC, ABS, PC electroplating for materials as aluminum, iron and stainless steel. FP771 is particularly suited for applications where high transparency, high speed curing and clear for encapsulating of electronic devices.
ULTRAWIDE FP771 is suited for bonding to plastics. FP771 exhibits flexibility and fracture energy.
Physical Properties
Composition | Acrylic resin |
Chemical Class | Liquid @ 25oC |
Appearance | Colorless Liquid |
Viscosity, cps | 200~400 25oC (S21, 50 rpm) |
Refractive Index nD | 1.4753 @25oC |
Solvent Content, % | 0 |
Mechanical Properties
Durometer Hardness, Shore D | 75±2 |