Thermal interface material or TIM can be defined as any material that is applied between the interfaces of two components to enhance the thermal coupling between these devices. Usually, TIM is used between a heat-generating device (e.g. microprocessor, photonic integrated circuits, etc.) and a heat dissipating device (e.g. heat sink) to remove the heat from the component.
The importance of Thermal Interface Materials
While the surfaces to be places in contact may appear flat, closer inspection will show imperfections such as marks, warped or imperfectly flat surfaces, surface porosity, etc. These multiple voids prevent actual physical contact between the two surfaces, making the thermal resistance of the mechanical interface a lot higher than might be expected based on the apparent area of contact.
In this case, thermal interface materials is used to fill this gaps or voids with a substance that’s got a better thermal conductivity than the air so as to improve heat transfer between the two surface.
The difference can be significant, as typical TIMs conduct heat roughly 100 times better than the air they displace.
Graphite products are used when the key design criteria is both excellent thermal management and electrical conductivity
How to choose suitable Thermal Interface Materials?
Choosing a Thermal Interface Materials depends on a variety of factors, to be named as follow:
Heat Dissipation
Clamping Design
Device Footprint
Working Temperature
Clamping Pressure
Pressure limits
Surface Finish
Electrical Isolation
Reworkability
Packaging Requirements
In general, TIMs are available in a wide range of formats and the right TIMs for your application could significantly contribute to manufacturing cost as well as end-product quality. It is essential to consider all aspects of the design and how the material is packaged, please contact us for more consult for products and solutions regarding to Thermal Management.
