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GLT322-One Component Epoxy Adhesive

  • Product code: GLT322
  • Manufacturer: Gluditec
  • Package size: 30ml-70ml
  • Shelf Life: 6 months

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GLT322 is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength. This resin can be fast cured at low temperature and is suited for different kinds of materials bonding, it is especially good for plasitcs bonding. The durability level of this product is very high and this resin can pass many environmental test experiments. This product is well suited for heat sensitive components bonding, such as memory cards and C-MOS assembling.

Typical Uncured Properties

Appearance Liquid
Color Black
Viscosity 25oC, S14 5rpm, cps 128,000~192,000
Thixotropic Index 4~6
Filler grain size, um 2~5 (Max<10)
Filler ratio, % 23

Typical Curing Properties

Pot Life 25oC, day 2

Recommended Cure Time 80°C, min

 60

Recommended Cure Time 90°C, min

 50
Recommended Cure Time 100°C, min 40
Recommended Cure Time 120°C, min 30
Recommended Cure Time 150°C, min 20

Typical Cured Properties

Glass Transition Temp.,(DSC), °C 132
Glass Transition Temp.,(TMA), °C 152
CTE*8(<Tg), μm/m/ °C 48
CTE*8(>Tg), μm/m/ °C 162
Volume Shrinkage, % 2.9
Thermal Conductivity, W/mK 0.5
Thermal Resistance, m2K/W 0.006
Volume Resistivity, ohm-cm 4.5*10^15
Surface Resistivity, ohm 4.5*10^14
Dielectric Constant 100HZ 5.6

 

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