H48-2K is an ultra thin, silicon based gap filler which is designed for applications which require a high dielectric breakdown voltage combined with ultra low silicone outgassing. H48-2K is available in various formats such as standard sheets or custom die cuts to support both prototyping and high volume manufacturing.
FEATURES
Good thermal conductivity
Ultra-soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Shock and vibration absorber
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Property
H48-2K
Unit
Tolerance
Test Method
Colour
Dark Red
–
–
Visual
Thickness
0.1/0.2/0.3
mm
–
–
0.004/0.008/0.01
inch
–
–
Optimal Temperature Range
-45 to 200
°C
–
–
Density
2.4
g/cm³
±0.2
ASTM D792
Thermal Conductivity
2.2
W/mK
±0.2
ASTM D5470
Flammability Rating
V-0
–
–
UL 94
Dielectric Breakdown Voltage
1.2/2.5/3.5
kV/mm
±0.1/±0.2/±0.3
ASTM D149
Hardness
85
Shore A
±5
ASTM D2240
Volume Resistance
>1011
Ohm-m
–
ASTM D257
Elongation
50
%
–
ASTM D412
Shelf Life
36
months
–
–
Shelf Life with adhesive
(can be requalified for a
further 12)
