H48-6G Thermal Conductive Pad

H48-6G is a silicone based thermal interface pad which offers a good combination of low thermal impedance, good compressibility and a high dielectric breakdown voltage. H48-6G is available in various thicknesses and different formats such as custom die cuts or standard sheets. Additionally, both custom die cut pads and standard sheets can be supplied with either one of two side thermally conductive adhesive applied for greater ease of manufacture.

FEATURES

• Good thermal conductivity
• Ultra-soft and high compressibility
• Natural tack
• Easy to assemble
• Good insulator
• Shock and vibration absorber

APPLICATIONS

• Electronic components: IC, CPU, MOS
• LED – M/B, P/S, Heat Sink
• LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
• DDR II Module, DVD Applications, Hand-set applications, etc.