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Home > Products > By Application > Thermal Management > Heat Sink > High Conductivity TPG* Thermal Leveler

High Conductivity TPG* Thermal Leveler

  • Product code: TPG
  • Manufacturer: Momentive
  • Package size:
  • Shelf Life:
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  • Description
  • Specification
  • TDS/MSDS
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Momentive Performance Materials Inc. offers a unique high crystalline graphite known as Thermal Pyrolytic Graphite (TPG), which exhibits 4x higher thermal conductivity than copper but with ¼ of copper’s weight. TPG is manufactured from thermal decomposition of hydrocarbon gas at an extremely high temperature. The high alignment of the graphene layers gives the product superior thermal conductivity which makes it an excellent thermal management material for:
– Thermal leveler
– Wafer susceptor
– Thermal strap
– Heat sink fin

FEATURES:

  •  Highly oriented crystals in a layered structure
  •  In-plane conductivity (1,500~1,700 W/m-K)
  •  Fully dense ceramic (2.25 gm/cm3)
  •  Thickness 0.010″ (0.25mm) ~ 0.600″ (15mm)
  •  Typical size up to 4″ (100mm) x 12″ (300mm)
  •  Can be joined for larger geometries
  •  Resilient layered structure
  •  Easily machined, provided as plates or as final shapes
  •  Compatible with many encapsulating techniques

APPLICATIONS:

  • Semiconductor wafer processing
  • Microelectronic packaging
  • Finned heat sinks

 

Property

Thermal Conductivity

(W/m-K)

 

Thermal Expansion

(10-6/°C)

 

 

 Flexural Strength

(MPa)

Stiffness

 (GPa)

 

Specific Heat\

(J/gm-°C)

Density
(gm/cm3)
Measurement      a-b axisc axisa-b axisc axisa-b axisc axis  C11C33  
Value     1500~17006~1002536.738.51050360.702.25

 

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