HM4278 – HOT MELT POLYAMIDE ADHESIVE

The adhesive known as HM4278 is a polyamide adhesive containing dimer acid that provides high performance. It is specifically designed for applications that require high outputs and offers a good balance of properties at both high and low temperatures, thanks to its low viscosity.

FEATURES

• Fast set
• Heat, chemical, and grease resistant
• Good chemical and grease resistant

KEY BENEFITS

• Easy application to substrate
• Quick processing times
• Suitable for applications with harsh environmental condition

APPLICATION

HM4278 can be applied in conventional hot melt applicators at temperatures between 392 – 437°F (200 -225°C). Caution must be taken as polyamides will absorb moisture from the surrounding environment and lead to bubbling in the melting units.