The HumiSeal 1B51 Conformal Coating, made of synthetic rubber, is a fast-curing, one-component solution that is ideal for circuit assemblies and provides easy repair. Its low moisture vapor permeability, flexibility, and unique base polymer ensure minimal stress on components while offering protection against moisture and environmental factors. This coating can be applied using spraying, brushing, or dipping methods.
FEATURES
- a fast drying
- single component
- synthetic rubber
- used in combination with Thinner 535/521/521 EU
HumiSeal 1B51 conformal coating has
- excellent moisture and environmental protection for printed circuit assemblies
- extremely low moisture vapor permeability
- excellent flexibility, enabling low stress on components
- full compliance with the RoHS directive 2015/863/EU
- recognition under UL File Number E105698
| Product Specification | |
| Density, per ASTM D1475 | 0.89 ± 0.01 g/cm3 |
| Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 22 ± 1.5 % |
| Viscosity, per Fed-Std-141, Meth. 4287 | 185 ± 30 centipoise |
| VOC | 694 grams/litre |
| Drying Time to Handle per Fed-Std-141, Meth. 4061 | 10 minutes |
| Recommended Coating Thickness | 25 – 75 microns |
| Recommended Curing Conditions | 24 hrs @ RT or 30 min @ 76°C |
| Time Required to Reach Optimum Properties | 7 days |
| Recommended Thinner (dipping & brushing) | HumiSeal Thinner 535 |
| Recommended Thinner (spraying) | HumiSeal Thinner 521, 521EU |
| Recommended Stripper | HumiSeal Stripper 1080, 1080EU |
| Shelf Life at Room Temperature, DOM | 18 months |
| Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 125°C |
| Coefficient of Thermal Expansion – TMA | 55 ppm/°C |
| Glass Transition Temperature – DSC | 14°C |
| Modulus – DMA | 93.1 MPa @ -20°C73.5 MPa @ 0°C35.3 MPa @ 20°C |
| Moisture Vapor Transmission, per ASTM E398-03 | <1 g/m2·day·mil |
| Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
| Dielectric Breakdown Voltage, per ASTM D149 | 4900 volts |
| Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.5 |
| Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.07 |
| Insulation Resistance, per MIL-I-46058C | 2.0 x 1014 ohms (200TΩ) |
| Moisture Insulation Resistance, per MIL-I-46058C | 1.0 x 1010 ohms (10GΩ) |
| Fungus Resistance, per ASTM G21 | Passes |
