Product Introduction: HumiSeal® 1B73
HumiSeal® 1B73 is a fast-drying, single-component acrylic conformal coating designed for printed circuit assemblies. Offering excellent protection against moisture and dirt, it ensures the longevity and performance of electronic components. HumiSeal® 1B73 is available in pre-blended products with varying viscosities, eliminating the need for further dilution. When fully cured, it exhibits consistent properties across all variants.
HumiSeal® 1B73 Features:
- Excellent flexibility
- Protection against moisture and dirt
- Fluoresces under UV light for easy inspection
- Easily repairable
- Meets MIL-I-46058C, IPC-CC-830, IEC61086, and IEC60664-3 standards
- Recognized under UL File Number E105698
- Compliant with REACH and RoHS Directive EU 2015/863
- Available in a range of pre-blends and thinners for various application methods
HumiSeal® 1B73 Applications:
- Can be applied to cleaned substrates or those assembled with low-residue “no clean” materials
- Contact HumiSeal for further assistance with pre-blends and application methods
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
| Product | Viscosity (cPs) | Solids (%) | Density (g/cm³) | VOC (g/L) | Shelf Life (DOM, months) |
| 1B73 | 250 ± 20 | 29.5 ± 2 | 0.92 ± 0.02 | 661 | 24 |
| 1B73 PB 23 CPS | 23 ± 5 | 15 ± 1 | 0.90 ± 0.02 | 765 | 12 |
| 1B73 PB 38 CPS | 38 ± 5 | 19.5 ± 1.5 | 0.91 ± 0.03 | 728 | 12 |
| 1B73 PB 55 CPS | 55 ± 5 | 21 ± 1.5 | 0.91 ± 0.03 | 718.9 | 12 |
| 1B73 PB 65 CPS | 65 ± 5 | 22 ± 2 | 0.91 ± 0.02 | 713.7 | 18 |
| 1B73/73 PB 25 CPS | 25 ± 5 | 15.5 ± 1 | 0.91 ± 0.02 | 769 | 12 |
| 1B73/521 PB 25 CPS | 25 ± 5 | 15 ± 1 | 0.90 ± 0.02 | 760 | 24 |
| 1B73/521 PB 65 CPS | 65 ± 5 | 21 ± 1 | 0.91 ± 0.02 | 719 | 24 |
| 1B73/730EU PB 55 | 55 ± 5 | 18.5 ± 1.5 | 0.94 ± 0.02 | 741.7 | 12 |
| 1B73/730EU PB 80 | 80 ± 5 | 20.5 ± 1.5 | 0.93 ± 0.02 | 739.4 | 12 |
| Product Specification | |
| Density, per ASTM D1475 | 0.92 ± 0.02 g/cm³ |
| Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 29.5 ± 2 % |
| Viscosity, per Fed-Std-141, Meth. 4287 | 250 ± 20 centipoise |
| VOC | 661 grams/liter |
| Drying Time to Handle per Fed-Std-141, Meth. 4061 | 30 minutes |
| Recommended Coating Thickness | 25 -75 microns |
| Recommended Curing Conditions | 24 hrs @ RT or 2 hrs @ 76°C |
| Time Required to Reach Optimum Properties | 7 days |
| Recommended Thinner | HumiSeal® Thinner 73 |
| Recommended Stripper | HumiSeal® Stripper 1080, 1080A |
| Shelf Life at Room Temperature, DOM | 24 months |
| Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 125°C |
| Coefficient of Thermal Expansion – TMA | 67 ppm/°C |
| Glass Transition Temperature – DSC | 42°C |
| Modulus – DMA | 11.1 MPa |
| Flammability, per UL 94 | V-0 |
| Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
| Dielectric Breakdown Voltage, per ASTM D149 | 6300 volts |
| Dielectric Constant, at 1MHz and 25°C, per ASTM D150-98 | 2.6 |
| Dissipation Factor, at 1MHz and 25°C, per ASTM D150-98 | 0.01 |
| Insulation Resistance, per MIL-I-46058C | 5.5 x 1014 ohms (550TΩ) |
| Moisture Insulation Resistance, per MIL-I-46058C | 7.0 x 1010 ohms (70GΩ) |
| Fungus Resistance, per ASTM G21 | Passes |
