Product Introduction
HumiSeal® 1C55 is a low-viscosity silicone coating ideal for precision dipping and spraying applications. It is perfect for high-throughput production environments demanding fast thermal curing and uniform coatings.
HumiSeal® 1C55 Features:
- Ultra-low viscosity for uniform application
- Fast thermal curing (10-15 min at 105-130°C)
- Optical brightener for black light inspection
- Repairable and RoHS compliant
HumiSeal® 1C55 Applications:
- Complex PCB assemblies requiring thin, even coatings
- High-throughput production environments
- Applications where repairability is essential
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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| Property | Value |
|---|---|
| Density, per ASTM D1475 | 0.98 ± 0.02 g/cm³ |
| Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 99% |
| Viscosity, per Fed-Std-141, Meth. 4287 | 195 - 400 cps |
| VOC | 0 g/L |
| Recommended Coating Thickness | 50 - 200 microns |
| Recommended Curing Conditions | 10 - 15 minutes @ 105 - 130°C |
| Time Required to Reach Optimum Properties | 15 minutes |
| Recommended Stripper | HumiSeal® Stripper 1091 |
| Shelf Life at Recommended Conditions, DOM | 12 months |
| Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 200°C |
| Glass Transition Temperature - DSC | < -65°C |
| Coefficient of Thermal Expansion - TMA | 154 ppm/°C |
| Modulus - DMA | 0.7 MPa @ -40°C 0.6 MPa @ 25°C 0.5 MPa @ 80°C |
| Tensile Strength | 0.15 MPa |
| Elongation | 16% |
| Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
| Dielectric Breakdown Voltage, per ASTM D149 | 7000 volts |
| Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.4 |
| Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.01 |
| Insulation Resistance, per MIL-I-46058C | 5.0 x 10¹⁴ ohms (500TΩ) |
| Moisture Insulation Resistance, per MIL-I-46058C | 1.0 x 10¹⁰ ohms (10GΩ) |
| Fungus Resistance, per ASTM G21 | Passes |
