HumiSeal® 1B15 is a single component, fast drying, easily repaired, acrylic conformal coating intended for use on printed circuit assemblies. HumiSeal® 1B15 coating is RoHS Directive 2002/95/EC compliant.
Product Specification | |
Density, per ASTM D1475 | 0.91 ± 0.02 g/cm³ |
Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 35 ± 3 % |
Viscosity, per Fed-Std-141, Meth. 4287 | 470 ± 20 centipoise |
VOC | 590 grams/litre |
Drying Time to Handle per Fed-Std-141, Meth. 4061 | 10 minutes |
Recommended Coating Thickness | 25 – 75 microns |
Recommended Curing Conditions | 24 hrs @ RT or 30 min @ 76°C |
Time Required to Reach Optimum Properties | 7 days |
Recommended Thinner (dipping & brushing) | HumiSeal Thinner 503 |
Recommended Thinner (spraying) | HumiSeal Thinner 521 |
Recommended Stripper | HumiSeal Stripper 1080 |
Shelf Life at Room Temperature, DOM | 18 months |
Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 125°C |
Coefficient of Thermal Expansion – TMA | 77 ppm/°C |
Glass Transition Temperature – DSC | 15°C |
Modulus – DMA | 69.5 MPa |
Dielectric Withstand Voltage, volts per MIL-I-46058C | >1500 |
Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.03 |
Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.01 |
Insulation Resistance, per MIL-I-46058C | 3.5 x 1014 ohms (350TΩ) |
Moisture Insulation Resistance, per MIL-I-46058C | 4.0 x 1010 ohms (40GΩ) |
Fungus Resistance, per ASTM G21 | Passes |