HumiSeal® 1B66 is a fast drying, single component, acrylic conformal coating that provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® 1B66 demonstrates outstanding flexibility and is easily repaired. HumiSeal® 1B66 coating is RoHS Directive 2002/95/EC compliant.
Product Specification | |
Density, per ASTM D1475 | 0.91 ± .02 g/cm3 |
Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 35 ± 3 % |
Viscosity, per Fed-Std-141, Meth. 4287 | 200 ± 15 centipoise |
VOC | 592 grams/litre |
Drying Time to Handle per Fed-Std-141, Meth. 4061 | 10 minutes |
Recommended Coating Thickness | 25 – 75 microns |
Recommended Curing Conditions | 24hrs @ RT or 30min @ 76°C |
Time Required to Reach Optimum Properties | 7 days |
Recommended Thinner (dipping & brushing) | HumiSeal Thinner 503 |
Recommended Thinner (spraying) | HumiSeal Thinner 521 |
Recommended Stripper | HumiSeal Stripper 1080 |
Shelf Life at Room Temperature, DOM | 24 months |
Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 125°C |
Coefficient of Thermal Expansion – TMA | 175 ppm/°C below Tg
345 ppm/°C above Tg |
Glass Transition Temperature – DSC | 14°C |
Modulus – DMA | 850 MPa @ 40°C |
Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
Dielectric Breakdown Voltage, per ASTM D149 | 7500 volts |
Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.5 |
Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.01 |
Insulation Resistance, per MIL-I-46058C | 8.0 x 1012 ohms (800TΩ) |
Moisture Insulation Resistance, per MIL-I-46058C | 6.0 x 1010 ohms (60GΩ) |
Fungus Resistance, per ASTM G21 | Passes |