HumiSeal® 1B73 is a single component, fast drying, acrylic conformal coating intended for use on printed circuit assemblies. HumiSeal® 1B73 is also produced as pre-blended products, at a range of viscosities, suitable for a variety of application methods without further dilution. After complete cure, the properties of HumiSeal® 1B73 Preblends and HumiSeal® 1B73 are comparable.
Product Specification
Density, per ASTM D1475
0.92 ± 0.02 g/cm³
Solids Content, % by weight per Fed-Std-141, Meth. 4044
29.5 ± 2 %
Viscosity, per Fed-Std-141, Meth. 4287
250 ± 20 centipoise
VOC
661 grams/liter
Drying Time to Handle per Fed-Std-141, Meth. 4061
30 minutes
Recommended Coating Thickness
25 -75 microns
Recommended Curing Conditions
24 hrs @ RT or 2 hrs @ 76°C
Time Required to Reach Optimum Properties
7 days
Recommended Thinner
HumiSeal® Thinner 73
Recommended Stripper
HumiSeal® Stripper 1080, 1080A
Shelf Life at Room Temperature, DOM
24 months
Thermal Shock, 50 cycles per MIL-I-46058C
-65°C to 125°C
Coefficient of Thermal Expansion – TMA
67 ppm/°C
Glass Transition Temperature – DSC
42°C
Modulus – DMA
11.1 MPa
Flammability, per UL 94
V-0
Dielectric Withstand Voltage, per MIL-I-46058C
>1500 volts
Dielectric Breakdown Voltage, per ASTM D149
6300 volts
Dielectric Constant, at 1MHz and 25°C, per ASTM D150-98
2.6
Dissipation Factor, at 1MHz and 25°C, per ASTM D150-98
