HumiSeal® 1B73 is a single component, fast drying, acrylic conformal coating intended for use on printed circuit assemblies. HumiSeal® 1B73 is also produced as pre-blended products, at a range of viscosities, suitable for a variety of application methods without further dilution. After complete cure, the properties of HumiSeal® 1B73 Preblends and HumiSeal® 1B73 are comparable.
| Product Specification | |
| Density, per ASTM D1475 | 0.92 ± 0.02 g/cm³ |
| Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 29.5 ± 2 % |
| Viscosity, per Fed-Std-141, Meth. 4287 | 250 ± 20 centipoise |
| VOC | 661 grams/liter |
| Drying Time to Handle per Fed-Std-141, Meth. 4061 | 30 minutes |
| Recommended Coating Thickness | 25 -75 microns |
| Recommended Curing Conditions | 24 hrs @ RT or 2 hrs @ 76°C |
| Time Required to Reach Optimum Properties | 7 days |
| Recommended Thinner | HumiSeal® Thinner 73 |
| Recommended Stripper | HumiSeal® Stripper 1080, 1080A |
| Shelf Life at Room Temperature, DOM | 24 months |
| Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 125°C |
| Coefficient of Thermal Expansion – TMA | 67 ppm/°C |
| Glass Transition Temperature – DSC | 42°C |
| Modulus – DMA | 11.1 MPa |
| Flammability, per UL 94 | V-0 |
| Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
| Dielectric Breakdown Voltage, per ASTM D149 | 6300 volts |
| Dielectric Constant, at 1MHz and 25°C, per ASTM D150-98 | 2.6 |
| Dissipation Factor, at 1MHz and 25°C, per ASTM D150-98 | 0.010 |
| Insulation Resistance, per MIL-I-46058C | 5.5 x 1014 ohms (550TΩ) |
| Moisture Insulation Resistance, per MIL-I-46058C | 7.0 x 1010 ohms (70GΩ) |
| Fungus Resistance, per ASTM G21 | Passes |
