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PCB Assembly

One-stop PCB Assembly
Materials & Solutions Provider

As an experienced solution provider of materials for use in joining technologies, PROSTECH is confident to enable customers to meet their goals for special PCB design, reliability, performance, cost efficiency, and sustainability.

Soldering Materials

Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for many applications.

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Underfill Adhesive

The materials have been optimized for capillary underfill and reworkability.

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Edgebond Adhesive

Dispensed on the corners or edges of the component, these materials are designed to optimize reliability and cost of assembly.

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Thermal Management Materials

Offer thermal management solutions and innovations for the next generation of electronics

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Die Attach

Offer thermal management solutions and innovations for the next generation of electronics

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Stacking

Staking is a method of anchoring the components in place, increasing the mechanical strength of electronic components

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EMI Shielding

This EMI Shielding Method is an advanced solution for increasingly modern light-weight devices

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More Insights about PCB Assembly

INFORMATION REQUEST

All information will be confidential and only purposed to select the appropriate products

Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMISR4

  • Product code: 84-1LMISR4
  • Manufacturer: Henkel
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  • Shelf life: 365 days
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Notices when setup a PoP Assembly with Solder Paste and Flux

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Package-on-Package Process and Solder Paste usage notices

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What is PoP Assembly? What are benefits?

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What is low temperature solder paste?

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Advantages and Disadvantages of Low temperature soldering

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