Image sensors and camera modules for handheld devices (smartphones and tablets) and advanced markets (automotive, medical, military, …), are constantly evolving, enabling these device manufacturers to differentiate their products. This fast-moving, innovative market consistently demands better and more sophisticated adhesive technologies to help deliver existing and next-generation camera module assembly applications (especially) and image sensors (generally).
Configuration of Compact Camera Module
Applications in Camera Module Assembly
FPC Interconnect and Reinforcement Solution
Chip on Board
Die Attach or Die Bonding
Wire Bonding & Encapsulating
