Image sensors and camera modules for handheld devices (smartphones and tablets) and advanced markets (automotive, medical, military, …), are constantly evolving, enabling these device manufacturers to differentiate their products. This fast-moving, innovative market consistently demands better and more sophisticated adhesive technologies to help deliver existing and next-generation camera module assembly applications (especially) and image sensors (generally).
Configuration of Compact Camera Module

Applications in Camera Module Assembly
FPC Interconnect and Reinforcement Solution

Chip on Board
Die Attach or Die Bonding
Wire Bonding & Encapsulating
Underfill
Flip-chip side file
Cleaning
IR Filter Bonding
Voice coil motor (VCM) spacer bonding
Stiffener bonding
Lens Module Bonding
Prostech Total Solution
Useful Information
Elastomeric Materials Solutions for ADAS
Material Solutions for Advanced Driver Assistance Systems (ADAS) and Autonomous Driving Sensors Sensors play a key role in advanced driver