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Home > Products > By Application > Adhesives > Epoxy Adhesive > One-part Epoxy > JD 971-Epoxy for Electronic Devices of Low Temperature Cured

JD 971-Epoxy for Electronic Devices of Low Temperature Cured

  • Product code: JD 971
  • Manufacturer: Everwide
  • Package size:
  • Shelf Life: 6 months @-40oC ~ -5oC

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  • Description
  • Specification
  • TDS/MSDS
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JD971 is a one component epoxy for the application of electronic devices. This resin exhibits medium viscosity and cured under low temperature. This product exhibits excellent adhesion strength, chemical and solvent resistance. The crack and fatigue resistance of this resin are outstanding in many vibrational applications. This resin is suitable for low temperature curing and easy for working. This product is used widly in various areas in electronic devices and reinforcement.

Features

1. This product is a one component solvent-free system.
2. The hardening surface will not offer a surface oilness and poor gloss.
3. This resin offers excellent retention of electrical insulation properties under high humidity conditions.
4. The retained strength of this product after environmental test experiments is excellent.
5. This resin has excellent dimensional stability over a wide temperature range.
6. This resin complies to the 2011/65 EU RoHS regulations
7. This product complies to chlorine < 900ppm, bromine <900ppm, chlorine +bromine < 1500ppm

Typical Uncured Properties

Appearance Liquid
Color Black
Viscosity 25oC, S14 50rpm, cps 12,000~18,000
Thixotropic Index >1.8

Typical Cured Properties

Glass Transition Temp., (DSC)*1, oC 106
CTE*4 (<Tg ) ,μm / o C 64
CTE*4 (>Tg ) ,μm/ o C 218
Durometer Hardness, Shore D 83
Volume Resistivity, ohm-cm 4.5*10^15
Surface Resistivity, ohm 4.5*10^14

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    Outstanding Feature Product Group

    • epoxy adhesive

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    JD 971-Epoxy for Electronic Devices of Low Temperature Cured

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