JE085-2 is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength. This resin can be fast cure at medium low temperature and is suited for different kinds materials bonding. This resin has excellent durability. It has passed many different environmental tests and is suitable for applications that require low precipitation in the bonding area, such as the assembly of optical lens voice coil motors and C-MOS bonding of thermal components.

FEATURES

1. This product is solvent-free and non-volatile system.
2. This product has the characteristics of low precipitation, which can reduce pollution.
3. The surface of this cured product will not appear greasy, and it will show low gloss.
4. It offers excellent chemical resistance and solvent resistance.
5. ured resin has excellent protection and vibration resistance for electronic devices.
6. This product complies to the 20 11 / 6 5 E U RoHS regulations
7. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine <1500 ppm