JONES 21-360D is a high-performance thermal gap filler with 6.0 W/m·K conductivity. It is designed to cure at room temperature and offers excellent conformability for variable gaps with minimal mechanical stress.
21-360D Features
Thermal conductivity: 6.0 W/m·K
Flow rate: 33 g/min @ 90 psi
Clear boundary, electrically isolating
Low thermal resistance and high reliability
21-360D Applications
Cooling chassis and electronics frames
Telecom and power electronics
Consumer electronics and lighting
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?