JONES 21-361-SP01 is a soft, fully-cured, single-part silicone putty thermal gap filler. It transfers little to no pressure between interfaces and is designed for high-performance cooling applications.
21-361-SP01 Features
Thermal conductivity: 6.0 W/m·K
Soft and compliant with minimal stress
Electrically isolating and low thermal resistance
Fully cured and easy to dispense
21-361-SP01 Applications
Memory modules, radios, mass storage
Automotive, telecom, and IT infrastructure
LED lighting and GPS devices
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
