JONES 21-390 is a soft, single-part silicone putty thermal gap filler that requires no curing. It is ideal for large gap tolerances and for minimizing mechanical stress on sensitive components.
21-390 Features
Thermal conductivity: 9.0 W/m·K
Pre-cured and easily dispensable
Electrically isolating
Low thermal resistance
21-390 Applications
Cooling components to chassis or frame
Memory modules, mass storage devices
Automotive and telecommunication electronics
LCD/PDP panels, audio/video systems, GPS devices
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
