JONES 21-460 is a silicone-based, high-performance thermal interface material with 6.0 W/m·K thermal conductivity. It ensures efficient heat transfer between high watt-density chips and heat sinks without post-curing.
21-460 Features
High thermal conductivity: 6.0 W/m·K
Moderate viscosity for easy application
Low thermal resistance
No post-cure required
21-460 Applications
CPUs, GPUs, ASICs
Memory modules and Northbridge chipsets
LED solid-state lighting
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
