JONES 21-725 Phase Change Thermal Interface Material
JONES 21-725 is a phase change thermal material designed to optimize heat sink performance and improve component reliability. Solid at room temperature, it softens at ~50°C to fill microscopic gaps, minimizing bond-line thickness and thermal contact resistance.
21-725 Features
Low thermal resistance
Phase change at ~50°C
Excellent interface wetability
High reliability and RoHS compliant
Form: Pad
21-725 Applications
CPUs (Notebooks, Desktops, Servers)
Chipsets
GPUs
ASIC Chips
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
