21-335 Series is Two-Part Thermal Gel with low viscosity, silicone putty thermal gap filler in which is cured in room temperature. It is designed to be used where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink.
Key Features
- Extreme Low stress induced during assembly
- Easy for rework
- Easily dispensable
- Cured in room Temperature
- Electrically Isolating
- Low Thermal Resistance
Applications
- Smart device/phone
- Cooling components to chassis, frame, or other mating components
- Memory modules
- Home & Small Office Network
- Mass Storage Devices
- Automotive Electronics
- Telecommunication Hardware
- Radios
- LED Solid State Lighting
- Power Electronics
- Set Top Boxes
- Audio & Video Component
- IT infrastructure
- GPS navigation and other portable
devices
Typical Properties
| Property | Value |
| Thermal Conductivity (W/m-K) | 3.2 |
| Thermal Resistance (°C.cm^2/W)@ 1mm | 3.05 |
| Color/ Part A | Green |
| Color/ Part B | Light grey |
| Before Cure | 520,000 |
| Viscosity as mixed (mPa-s) | 500,000 |
| Mix Ratio | 1:1 |
| (Cured) Color | Green |
| Tensile lap-shear strength (psi) |
18 |
| Density (g/cc) | 3.0 |
| Hardness (Shore OO) | 50 |
| Breakdown Voltage(kV/mm) | >6 |
| Volume Resistivity (ohm-cm) | >10^12 |
| Dielectric Constant @10MHz | 4.9 |
| Operation Temperature Range(°C) | -40~150 |
| Pot Life @ 25 °C (min) | 120 |
| Cure @ 25 °C (hrs) | 18 |
| Cure @ 100 °C (min) | 20 |
