JONES Thermal Grease 21-430
JONES 21-430 is a high-performance, silicone-based thermal grease designed for efficient heat transfer between high-wattage components and heat sinks. With a thermal conductivity of 3.3 W/m·K and no need for post-curing, it offers reliable, solvent-free performance and consistent thermal contact under assembly pressure.
21-430 Features
- Thermal conductivity: 3.3 W/m·K
- Moderate viscosity for easy application
- No post-curing required
- No dry-out at 150 °C
- High reliability and thermal performance
- Solvent-free formulation
21-430 Applications
- CPUs in notebooks, PCs, and servers
- LED solid-state lighting systems
- GPUs and Northbridge chipsets
- ASICs and high-wattage integrated circuits
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Properties | Thermal Grease 21-430 |
Test Method | |
Thermal | Thermal Conductivity (W/m·K) | 3.3 | HOT DISK |
Thermal Resistance @40 psi (°C·cm^2/W) | 0.119 | ASTM D5470 | |
Operating Temperature Range(°C) | -40~150 | JONES Test Method | |
Physical | Composition | Ceramic&Silicone | - |
Color | Grey | Visual | |
Typical Minimum Bondline Thickness (μm) | 50 | JONES Test Method | |
Viscosity @20rpm (Pa·s) | 350 | ASTM D2196 | |
Density (g/cm³) | 2.4 | ASTM D792 | |
Electrical | Breakdown Voltage (KV AC /mm) | >5.0 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^13 | ASTM D257 | |
Dielectric Constant @1MHz | 5.3 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL 94 |
